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Industries InformationListing Details

ID:17803
Title:Vertical die stacking goes 3D without TSV - Advanced Packaging
URL:http://www.electroiq.com
Category:Manufacturing: Packaging Stacking & Filling Equipment
Description:Oct 28, 2010 ... Andrew Smith, Ventmark Technology Solutions, presents a 3D die stacking technology to address package miniaturization.
Pagerank:6
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