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Industries InformationListing Details

ID:17806
Title:Xilinx adopts stacked-die 3D packaging : EDN Europe
URL:http://www.edn-europe.com
Category:Manufacturing: Packaging Stacking & Filling Equipment
Description:Nov 1, 2010 ... Xilinx has announced that several of the highest-density parts in its forthcoming Series 7 FPGAs will be constructed using multiple dice in ...
Pagerank:5
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